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Spacer LCP
Quick Overview
- Dust free LCP-200 is made of the No. 1 proven dust-free paper: new STACLEAN. A polyethylene film was put between two sheets of the dust-free paper, as illustrated below. STACLEAN is a proven dust-free paper long used by manufactures of semi-conductor industries,
- Superior prevention of static electricity: Moisture contained in STACLEAN paper prevents static electricity so that the interleaf paper and printed circuit board do not absorb dust floating in the air
- Automatic insertion and removal of the interleaf paper: polyethylene film between two sheets of dust-free paper provides no breathability, so that the vacuum arm can firmly hold and move the insertion paper:
- We provide any size of interleaf paper to fit your printed circuit board.
- To protect the surface of copper clad laminate from being scratched.
- To use ad a spacer between the board after black oxide treatment for inner layer pattern.
- To protect the surface of the board from being scratched and from dust during the manufacturing process of inner circuit board for multi-layer board.
- To use as mounting paper for conveyance of FPC that are cut before a laminating process, and also a spacer to protect the circuit pattern of FPC.